Beyond Moore: 3D Memory, 3D Packaging
David Bondurant, Retired PE, President of Vertical Memory
“If we make them smaller, we can make them faster” has been the approach to building faster computers over the last 70-years starting with the first transistors and continuing as we built increasingly more complex integrated circuits. This was known as “Moore’s Law”. Recently, our technology is no longer achieving higher densities as we scale to smaller features sizes first with NAND Flash and now with SRAM and DRAM. New techniques known as Beyond Moore are require to continue to build faster and more complex computers. I review the emergence of 3D memory and 3D packaging as today’s approach to building the fastest Supercomputers and AI Processors.
Lunch will be provided by the Pikes Peak LMAG
Speaker(s): David Bondurant,
Agenda:
Lunch
Presentation
Room: Tom Saponas Lounge (2nd Floor), Bldg: Engineering Building, 1420 Austin Bluffs Pkwy, Co, Colorado, United States, 80918
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